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LatestProducts
4 Layers High Quality Rigid-Flex PCB
Rigid-Flex PCB, Multilayer PCB, Flexible Printed Circuit Board
Description
Basic Info
- Model NO.: R8766B
- Material: Fr4+Pi
- Application: Digital Products
- Flame Retardant Properties: V0
- Base Material: Copper
- Brand: FPC
- Layer: 4L
- ISO/Ts 16949: Automotive
- ISO 13485: Medical Devices
- Trademark: BL
- Specification: RoHS
- HS Code: 85340090
- Structure: Hybrids Circuit Board
- Combination Mode: Adhesive Flexible Plate
- Conductive Adhesive: Conductive Silver Paste
- Processing Technology: Delay Pressure Foil
- Insulation Materials: Epoxy Resin
- Dimension: 30.04mm*19.17mm
- ISO9001:2008: Quality Management Qualification
- ISO 14001 2004: Environmental Qualification
- UL: E228871
- Transport Package: Vacuum Package
- Origin: China
Product Description
4 layers High quality rigid-flex PCB
Type: Rigid-Flex PCB
Layer: 4L
Dimension: 30.04mm*19.17mm
Line Width/Space: 0.1mm/0.1mm
Material: 18um Cu/13um ADH/13um PI/13um ADH/18um Cu (Ra)
Coverlay: 0.58mil PI/0.6mil ADH/blue ink
Other Material: Shielding film/prepreg
Surface: ENIG (Au: 0.05~0.1um, Ni: 3~9um)
Outline Tolerance: +/-0.2
Coverlay Tolerance: +/-0.3
General Tolerance: +/-0.2
Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
| Main Technique Index | ||
| Description | Parameters | |
| Polyimide | Polyester | |
| Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
| Copper Thickness (um) | 12,17.5,35,50,70,105 | |
| Min. Line Width/Line Space (mm) | 0.075/0.075 | |
| Min. Hole Size (mm) | 0.15 | |
| Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
| Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
| Solder Resistance | 260C 10 seconds | 204C 5 seconds |
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| Surface Treatment | ||
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
| Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
| OSP (In house) | N/A | 300mm×400 MM |
| ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |
