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  • Phone

    86-592-6****

  • Address

    No. 198, Houxiang Road, Haicang District, Xiamen, Fujian, China

  • E-mail

    k@waimaotong.com

LatestProducts
Multilayer Flexible Printed Circuit Board

Multilayer Flexible Printed Circuit Board

FPC Connector, Flex Cable, PCB

Description

Basic Info
  • Model NO.: M6824A
  • Material: Polyimide
  • Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Wearable
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Brand: FPC
  • Surface Treatment: Enig
  • Transport Package: Vacuum Package
  • Origin: China
  • Structure: Multilayer FPC
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Dimensions: 92.13 X 52.16mm
  • Trademark: BL
  • Specification: RoHs
  • HS Code: 85340090
Product Description

 M6824A
Dimensions: 92.13 x 52.16mm
Line width/space: 0.16mm/0.16mm
Surface treatment: cold plating
Ni: 2 to 9um
Au: 0.05 to 1um
Outline tolerance: ±0.2mm
Cover layer tolerance: ±0.3mm
Minimum hole: 0.2mm
Minimum pitch: 0.2mm

 

Advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Multilayer Flexible Printed Circuit Board

Main Technique Index
Description Parameters
Polyimide Polyester
Base film Thickness (um) 12.5,25,35,50 12.5,25,35,50
Copper Thickness (um) 12,17.5,35,50,70,105
Min. Line Width/Line Space (mm) 0.075/0.075
Min. Hole Size (mm) 0.15
Tolerance (mm) Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm) Above 1.0 Above 0.8
Solder Resistance 260C 10 seconds 204C 5 seconds

 

 

 
Surface Treatment
Content Normal coating thickness  Normal PNL size
Plating nickel gold (In house) Ni:2-9um;Au:0.03-0.09um 300mm×400 MM
Plating hard gold (In house) Ni:2-9um;Au:0.1-1.0um 300mm×400 MM
Plating soft gold (In house) Ni:2-9um;Au:0.03-0.09um 300mm×400 MM
Plating pure tin (In house) 2.0-8.0um 300mm×400 MM
Immersion Tin (In house) 0.3-0.6um 300mm×400 MM
OSP (In house) N/A 300mm×400 MM
ENIG (Hard Nickel)  (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
ENIG (Soft Nickel)  (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
ENEPIG (Hard Nickel)  (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
HASL (Outsource) Cover the pads with min thickness 1~2 um 300mm×400 MM
Immersion silver (Outsource) Per standand creteria 300mm×400 MM

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