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    86-592-6207953

  • Address

    No. 198, Houxiang Road, Haicang District, Xiamen, Fujian, China

  • E-mail

    k@waimaotong.com

LatestProducts

                            Medical Devices Use Single-Layer Flexible PCB

Medical Devices Use Single-Layer Flexible PCB

medical flexible
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Description

Basic Info
  • Model NO.: S7689E
  • Material: Polyimide
  • Application: Medical Devices
  • Dimensions: 39 * 15mm
  • Trademark: BL
  • Origin: China
  • Structure: Single-Sided FPC
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Width/Space: 0.50/0.25mm
  • Specification: single side
  • HS Code: 85340090
Product Description

Medical devices use single-layer flexible PCB

Model: S7869E
Material: 1oz CU (RA) 
Coverlay: Dupont HXC1225
Surface treatment: immersion tin (SN: 0.3 to 0.6um) 
Dimensions: 39 x 15mm 
Width/space: 0.50/0.25mm 

Advantage:

1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

Medical Devices Use Single-Layer Flexible PCB
Xiamen BOLION Workshop Capability
Material Cutting
Content Normal Special
Max dimension of material cutting 250MM× 450MM 250MM× 10000MM
Min dimension of material cutting 250MM× 100MM
 
Auto-machine cutting tolerance ± 1MM
 
Manually cutting tolerance ± 2MM
 
Mechanical Drilling
Content Normal Special
Min drill Dia. Dia. 0.20MM Dia. 0.15MM
Max drill Dia. Dia. 6.35MM
 
Min drill space 0.15MM 0.125MM
Drill hole Dia. tolerance ± 0.05 MM
 
Laser Drilling
Content Normal Special
Min drill Dia. Dia. 0.15MM Dia. 0.1MM
Max drill Dia. Dia. 6.35MM
 
Min drill space 0.1MM
 
Drill hole Dia. tolerance ± 0.02 MM
 
Copper plating
Content Normal Special
Copper plating capacity(thickness of hole plating) 8-15um; 20-30 um (± 5um' s distribution) 30-70 um
Max PNL dimension for PTH 250MM× 350MM 250MM× 2000MM
Aspect ratio (= board thickness / min via diameter) 2 max for 0.10 mm vias 3 max for 0.10 mm vias
4 max for 0.15 mm vias 5 max for 0.15 mm vias
6 max for 0.20 mm vias 7 max for 0.20 mm vias
8 max for 0.25 mm vias 9 max for 0.25 mm vias
Blue photosensitive etching-resist ink (Silkscreen)
Content Normal Special
Max PNL dimension of screen printer 300× 450MM 250MM× 2000MM
Thickness of photo image ink 15-20um 10-40um
Dry film 
Content Normal Special
Max production dimension of dry film 250MM× 350MM 330MM× ∞   MM
Thickness of dry film 30um 20um; 40um; 50um
Exposure
Content Normal Special
Space between pads and line (panel plating) ≥ 0.15MM ≥ 0.10MM
Space between pads and line (via pads pattern plating) ≥ 0.30MM ≥ 0.20MM
Layer to layer misregistration tollerance 0.2MM 0.10MM
Min size of square solder mask opening 0.40MM× 0.40MM
 
Min circular solder mask open size Dia. 0.35MM
 
Min width of solder mask 0.15MM 0.10MM
Solder mask bridge aspect ratio (=length/width) 10 max for 0.10 mm width 15 max for 0.10 mm width
15 max for 0.15 mm width 20 max for 0.15 mm width
20 max for 0.20 mm width 25 max for 0.20 mm width
Space between solder mask open and trace  0.1mm 0.05mm
Max PNL size on exposure machine 250MM× 350MM 600MM× 750MM; 600MM× 10000MM (Space > 0.3MM)
Min dimension of non-PTH circular pad Dia. 0.3MM Dia. 0.2MM
Min anular ring width of PTH pad 0.125MM 0.10MM
Etching
Content Common Special
Max production size of etching 250MM× 350MM 500MM× ∞
Min trace & space width 0.06± 0.01 MM (copper thickness: 12 um) 0.05± 0.01 MM (copper thickness: 12 um)
0.075± 0.015 MM (copper thickness: 18 um) 0.065± 0.015 MM (copper thickness: 18 um)
0.1± 0.02 MM (copper thickness: 25~35 um) 0.085± 0.02 MM (copper thickness: 25~35 um)
0.1± 0.03 MM (copper thickness: 35~45 um) 0.085± 0.02 MM (copper thickness: 25~35 um)
Coverlay alignment
Content Normal Special
Coverlay alignment tolerance ± 0.30 MM (manually operating) ± 0.20 MM
± 0.20 MM (fixturally operating) ± 0.0.15 MM
Min space between opening and pad 0.2MM 0.15MM
Overlap of coverlay opening and iland finger or pads 0.5 MM 0.3 MM for Circular pads
Lamination
Content Normal Special
PNL size on quick press 250MM× 400 MM 340MM× 5000MM
PNL size on traditional vacuum press 630× 550MM
 
Adhesive squeeze when laminating Quick press: 6± 2mil
 
Vacuum press: 3± 1mil
 
Silkscreen
Content Normal Special
Legend ink color white, black  Per request
solder mask color Yellow, green, amber Per request
silver/carbon pastes color silver pastes: silver; carbon pastes: black
 
Working size of silkscreen table  350 MM× 700 MM  250MM× 2000MM
Min character width 0.125 MM 0.10 MM
Min character height 0.80 MM 0.70 MM
Space between character and pad opening 0.5 MM 0.3 MM
Silkscreen alignment tolerance ± 0.30MM ± 0.20 MM
Silkscreen silver pastes tolerance    ± 0.50MM ± 0.40 MM
Silkscreen solder mask tolerance ± 0.50MM ± 0.30 MM
Min distance between silkscreen to outline 0.3 MM
 
Min distance between silkscreen to NPTH 0.3 MM
 
Printed ink thickness Legend character: 8-15 um 
 
Solder mask: 15-25 um 
 
Silver ink: 10~25 um
 
Carbon ink: 10-20um
 
Carbon ink: 10-20um
 
Final finshing
Content Normal coating thickness   Normal PNL size
Plating nickel gold (In house) Ni: 2-9um; Au: 0.03-0.09um 300mm× 400 MM
Plating hard gold (In house) Ni: 2-9um; Au: 0.1-1.0um 300mm× 400 MM
Plating soft gold (In house) Ni: 2-9um; Au: 0.03-0.09um 300mm× 400 MM
Plating pure tin (In house) 2.0-8.0um 300mm× 400 MM
Immersion Tin (In house) 0.3-0.6um 300mm× 400 MM
OSP (In house) N/A 300mm× 400 MM
ENIG (Hard Nickel)  (In house) Ni: 2-6um; Au: 0.03-0.10um 300mm× 400 MM
ENIG (Soft Nickel)  (In house) Ni: 2-6um; Au: 0.03-0.10um 300mm× 400 MM
ENEPIG (Hard Nickel)  (In house) Ni: 2-6um; Au: 0.03-0.10um 300mm× 400 MM
HASL (Outsource) Cover the pads with min thickness 1~2 um 300mm× 400 MM
Immersion silver (Outsource) Per standand creteria 300mm× 400 MM
Electrical test (Flying probe tester for sample)
Content Normal Special
Max test points qty 4096
 
Min probe 0.25MM 0.15MM
Max probe 1.70MM
 
Safe distance between test probes 0.20MM
 
Stiffener, PSA alignment tolerance
Content Normal Special
Min safe space between alignments and pads opening ± 0.50 MM ± 0.30 MM
Tolerance without hole-centered alignments ± 0.40 MM ± 0.40 MM
Tolerance with hole-centered alignments ± 0.2 MM
 
Min strip width of PSA 2MM 1.0 MM
Min seperate PSA size 13× 2.0 MM
 
Die cutting
Content Normal Special
Outline manually cutting (Outline length≤ 100MM) ± 0.20 MM (Need manually cut guide line)
 
Outline manually cut (Outline length > 100MM) ± 2 ‰
 
Outline soft tooling cut (Outline length≤ 100MM) ± 0.20 MM
 
Outline soft tooling cut (Outline length > 100MM)   ± 2‰
 
Outline etching die cut (Outline length≤ 100MM) ± 0.10 MM
 
Outline etching die cut (Outline length > 100MM) ± 1.5‰
 
Outline normal hard tooling cut (L< 100MM) ± 0.10 MM
 
Outline normal hard tooling cut (100≤ L< 150MM) ± 0.15 MM
 
Outline normal hard toolingcut (L≥ 150MM) ± 1.5‰ ± 1.3‰
Outline precise hard tooling cut (L< 100MM) ± 0.05 MM
 
Outline precise hard tooling cut (100≤ L< 150MM) ± 0.1 MM
 
Outline precise hard toolingcut (L≥ 150MM) ± 1.2‰ ± 1.0‰
Outline segmented cut ± 1.5‰ (soft tooling)
 
Min punching hole Dia. and tolerance Dia. 0.60 ± 0.05 MM
 
Tolerance for hole to board edge  1.0 MM(normal soft die cut tooling) 0.50 MM(Etching die cut tooling, normal hard tooling)
Tolerance for trace center to board edge  0.10 MM 0.08 MM(precise hard tooling)
Package
 

 
Content Normal Special
Tray Per product size
 
Low viscosity PET layer 300× 210MM
 
Ziplock bag Per product size
 
Vacuum sealing package 16cmx23cm, 20cmx34cm, 28cmx36cm, 30cmx50cm