86-592-6207953
No. 198, Houxiang Road, Haicang District, Xiamen, Fujian, China
Consumer Electronics of Flexible Printed Circuit Board
Model:S9601A
Material: 35um Cu (RA) rolling light copper
Thickness: 0.13mm
Copper thickness: 1oz
Surface treatment: electroless pure tin deposition, 0.3 to 0.6um
Dimensions: 74.17 x 34.18mm
Line width/space: 0.50mm
Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Xiamen Bolion Circuit Co., Ltd. Is established in Jan. 23, 2003. It owes 24, 000 sq. M of clean plant area, most advanced FPC manufacturing equipments and testing instruments. The monthly capacity is 16, 000sq. M of high-qualified Single-sided, Double-sided, Dual-access, Multilayer, Air-gap FPCs and Rigid-Flex PCBs, which are widely used in aerospace, automotive, medical devices, industrial control, consumer electronics, etc.
We a permanent member of CPCA (China Printed Circuit Association), a High and New Tech Enterprise of Xiamen City, one of Chinese top 100 PCB enterprises, one of Chinese top 10 innovative electronic components enterprises and won "national brand enterprises" in PCB China. We have passed ISO9001, TS16949, ISO14001 certificates. Series FPC and Rigid-flex boards are UL certificated and meet RoHS & WEEE environmental requirement (tested by SGS). Through good quality and best service, we enjoy good reputation in FPC field
We advocate "Integrity, Innovation, Harmony, Win-Win" enterprise spirits. With professional skills, advanced equipments, strict quality control, scientific management, reasonable prices and Law-abiding integrity of management ideal, we are dedicating to provide high-quality products and prompt service for customers.
Welcome to visit us and enjoy the success in business.
| Xiamen BOLION Workshop Capability | ||
| Material Cutting | ||
| Content | Normal | Special |
| Max dimension of material cutting | 250MM× 450MM | 250MM× 10000MM |
| Min dimension of material cutting | 250MM× 100MM |
|
| Auto-machine cutting tolerance | ± 1MM |
|
| Manually cutting tolerance | ± 2MM |
|
| Mechanical Drilling | ||
| Content | Normal | Special |
| Min drill Dia. | Dia. 0.20MM | Dia. 0.15MM |
| Max drill Dia. | Dia. 6.35MM |
|
| Min drill space | 0.15MM | 0.125MM |
| Drill hole Dia. tolerance | ± 0.05 MM |
|
| Laser Drilling | ||
| Content | Normal | Special |
| Min drill Dia. | Dia. 0.15MM | Dia. 0.1MM |
| Max drill Dia. | Dia. 6.35MM |
|
| Min drill space | 0.1MM |
|
| Drill hole Dia. tolerance | ± 0.02 MM |
|
| Copper plating | ||
| Content | Normal | Special |
| Copper plating capacity(thickness of hole plating) | 8-15um; 20-30 um (± 5um' s distribution) | 30-70 um |
| Max PNL dimension for PTH | 250MM× 350MM | 250MM× 2000MM |
| Aspect ratio (= board thickness / min via diameter) | 2 max for 0.10 mm vias | 3 max for 0.10 mm vias |
| 4 max for 0.15 mm vias | 5 max for 0.15 mm vias | |
| 6 max for 0.20 mm vias | 7 max for 0.20 mm vias | |
| 8 max for 0.25 mm vias | 9 max for 0.25 mm vias | |
| Blue photosensitive etching-resist ink (Silkscreen) | ||
| Content | Normal | Special |
| Max PNL dimension of screen printer | 300× 450MM | 250MM× 2000MM |
| Thickness of photo image ink | 15-20um | 10-40um |
| Dry film | ||
| Content | Normal | Special |
| Max production dimension of dry film | 250MM× 350MM | 330MM× ∞ MM |
| Thickness of dry film | 30um | 20um; 40um; 50um |
| Exposure | ||
| Content | Normal | Special |
| Space between pads and line (panel plating) | ≥ 0.15MM | ≥ 0.10MM |
| Space between pads and line (via pads pattern plating) | ≥ 0.30MM | ≥ 0.20MM |
| Layer to layer misregistration tollerance | 0.2MM | 0.10MM |
| Min size of square solder mask opening | 0.40MM× 0.40MM |
|
| Min circular solder mask open size | Dia. 0.35MM |
|
| Min width of solder mask | 0.15MM | 0.10MM |
| Solder mask bridge aspect ratio (=length/width) | 10 max for 0.10 mm width | 15 max for 0.10 mm width |
| 15 max for 0.15 mm width | 20 max for 0.15 mm width | |
| 20 max for 0.20 mm width | 25 max for 0.20 mm width | |
| Space between solder mask open and trace | 0.1mm | 0.05mm |
| Max PNL size on exposure machine | 250MM× 350MM | 600MM× 750MM; 600MM× 10000MM (Space > 0.3MM) |
| Min dimension of non-PTH circular pad | Dia. 0.3MM | Dia. 0.2MM |
| Min anular ring width of PTH pad | 0.125MM | 0.10MM |
| Etching | ||
| Content | Common | Special |
| Max production size of etching | 250MM× 350MM | 500MM× ∞ |
| Min trace & space width | 0.06± 0.01 MM (copper thickness: 12 um) | 0.05± 0.01 MM (copper thickness: 12 um) |
| 0.075± 0.015 MM (copper thickness: 18 um) | 0.065± 0.015 MM (copper thickness: 18 um) | |
| 0.1± 0.02 MM (copper thickness: 25~35 um) | 0.085± 0.02 MM (copper thickness: 25~35 um) | |
| 0.1± 0.03 MM (copper thickness: 35~45 um) | 0.085± 0.02 MM (copper thickness: 25~35 um) | |
| Coverlay alignment | ||
| Content | Normal | Special |
| Coverlay alignment tolerance | ± 0.30 MM (manually operating) | ± 0.20 MM |
| ± 0.20 MM (fixturally operating) | ± 0.0.15 MM | |
| Min space between opening and pad | 0.2MM | 0.15MM |
| Overlap of coverlay opening and iland finger or pads | 0.5 MM | 0.3 MM for Circular pads |
| Lamination | ||
| Content | Normal | Special |
| PNL size on quick press | 250MM× 400 MM | 340MM× 5000MM |
| PNL size on traditional vacuum press | 630× 550MM |
|
| Adhesive squeeze when laminating | Quick press: 6± 2mil |
|
| Vacuum press: 3± 1mil |
|
|
| Silkscreen | ||
| Content | Normal | Special |
| Legend ink color | white, black | Per request |
| solder mask color | Yellow, green, amber | Per request |
| silver/carbon pastes color | silver pastes: silver; carbon pastes: black |
|
| Working size of silkscreen table | 350 MM× 700 MM | 250MM× 2000MM |
| Min character width | 0.125 MM | 0.10 MM |
| Min character height | 0.80 MM | 0.70 MM |
| Space between character and pad opening | 0.5 MM | 0.3 MM |
| Silkscreen alignment tolerance | ± 0.30MM | ± 0.20 MM |
| Silkscreen silver pastes tolerance | ± 0.50MM | ± 0.40 MM |
| Silkscreen solder mask tolerance | ± 0.50MM | ± 0.30 MM |
| Min distance between silkscreen to outline | 0.3 MM |
|
| Min distance between silkscreen to NPTH | 0.3 MM |
|
| Printed ink thickness | Legend character: 8-15 um |
|
| Solder mask: 15-25 um |
|
|
| Silver ink: 10~25 um |
|
|
| Carbon ink: 10-20um |
|
|
| Carbon ink: 10-20um |
|
|
| Final finshing | ||
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni: 2-9um; Au: 0.03-0.09um | 300mm× 400 MM |
| Plating hard gold (In house) | Ni: 2-9um; Au: 0.1-1.0um | 300mm× 400 MM |
| Plating soft gold (In house) | Ni: 2-9um; Au: 0.03-0.09um | 300mm× 400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm× 400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm× 400 MM |
| OSP (In house) | N/A | 300mm× 400 MM |
| ENIG (Hard Nickel) (In house) | Ni: 2-6um; Au: 0.03-0.10um | 300mm× 400 MM |
| ENIG (Soft Nickel) (In house) | Ni: 2-6um; Au: 0.03-0.10um | 300mm× 400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni: 2-6um; Au: 0.03-0.10um | 300mm× 400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm× 400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm× 400 MM |
| Electrical test (Flying probe tester for sample) | ||
| Content | Normal | Special |
| Max test points qty | 4096 |
|
| Min probe | 0.25MM | 0.15MM |
| Max probe | 1.70MM |
|
| Safe distance between test probes | 0.20MM |
|
| Stiffener, PSA alignment tolerance | ||
| Content | Normal | Special |
| Min safe space between alignments and pads opening | ± 0.50 MM | ± 0.30 MM |
| Tolerance without hole-centered alignments | ± 0.40 MM | ± 0.40 MM |
| Tolerance with hole-centered alignments | ± 0.2 MM |
|
| Min strip width of PSA | 2MM | 1.0 MM |
| Min seperate PSA size | 13× 2.0 MM |
|
| Die cutting | ||
| Content | Normal | Special |
| Outline manually cutting (Outline length≤ 100MM) | ± 0.20 MM (Need manually cut guide line) |
|
| Outline manually cut (Outline length > 100MM) | ± 2 ‰ |
|
| Outline soft tooling cut (Outline length≤ 100MM) | ± 0.20 MM |
|
| Outline soft tooling cut (Outline length > 100MM) | ± 2‰ |
|
| Outline etching die cut (Outline length≤ 100MM) | ± 0.10 MM |
|
| Outline etching die cut (Outline length > 100MM) | ± 1.5‰ |
|
| Outline normal hard tooling cut (L< 100MM) | ± 0.10 MM |
|
| Outline normal hard tooling cut (100≤ L< 150MM) | ± 0.15 MM |
|
| Outline normal hard toolingcut (L≥ 150MM) | ± 1.5‰ | ± 1.3‰ |
| Outline precise hard tooling cut (L< 100MM) | ± 0.05 MM |
|
| Outline precise hard tooling cut (100≤ L< 150MM) | ± 0.1 MM |
|
| Outline precise hard toolingcut (L≥ 150MM) | ± 1.2‰ | ± 1.0‰ |
| Outline segmented cut | ± 1.5‰ (soft tooling) |
|
| Min punching hole Dia. and tolerance | Dia. 0.60 ± 0.05 MM |
|
| Tolerance for hole to board edge | 1.0 MM(normal soft die cut tooling) | 0.50 MM(Etching die cut tooling, normal hard tooling) |
| Tolerance for trace center to board edge | 0.10 MM | 0.08 MM(precise hard tooling) |
| Package |
|
|
| Content | Normal | Special |
| Tray | Per product size |
|
| Low viscosity PET layer | 300× 210MM |
|
| Ziplock bag | Per product size |
|
| Vacuum sealing package | 16cmx23cm, 20cmx34cm, | 28cmx36cm, 30cmx50cm |
